The temperature forcing system is suitable for all kinds of semiconductor chips, flash memory / EMC / PCB circuit boards, IC, optical communication (such as transceiver, transceiver, high and low temperature test, SFP optical module high and low temperature test, etc.), IC industry characteristics analysis, high-low temperature cycle test, temperature shock test, product failure analysis and other reliability tests
The temperature forcing system can be preset and is easily controllable. The vortex tube converts compressed air into two streams, a cold stream and a hot stream. It has no moving parts with a simple structure
Refrigeration coefficient is an important parameter affecting the performance of vortex tube. The refrigeration coefficient (cooling efficiency ratio) refers to the percentage of the compressed air input to the vortex tube to the output cold air. The total amount of compressed air is the denominator, and the amount of cold air less than the total amount of compressed air is the molecule. The lower the coefficient of refrigeration, the lower the temperature of the cool air. Coefficient also depends on the type/model of vortex generator in the vortex tube. For example: “high refrigeration coefficient type” or “low refrigeration coefficient type” vortex generator. Vortex generators with a high coefficient of refrigeration (greater than 50%) are used in most industrial applications. The high refrigeration coefficient vortex tube easily reduces the compressed air temperature at room temperature by 50-90°F (28-50°C).
High coefficient of cooling can provide more cold air, but the output cannot be extremely low temperatures. The combination of the output of the cold air flow and the cold air temperature in the high refrigeration coefficient mode can produce the maximum cooling capacity, or the maximum Btu/H (Kcal/H). A low refrigeration coefficient (less than 50%) means that a small amount of cold air can be generated at a lower temperature (low temperature can reach -40°F/-40°C). Simply put, the less cool air is produced, the colder the cool air is.
The characteristics of the vortex tube of the benchtop thermal forcing system are as follows:
Remember that the maximum cooling capacity (also called maximum cooling capacity or cooling capacity) is produced in a vortex tube with a high coefficient of refrigeration. The following table shows the heating and cooling values of the vortex tube under different inlet pressures and cooling efficiency ratios. In the table, the upper area represents the temperature drop of the colder side °F, and the lower area represents the temperature rise of the hot air end °F.
Benchtop thermal forcing system uses the vortex tube to perform high temperature or low temperature test for different test samples. What is the Vortex Tube? The vortex tube is a kind of energy separation device with very simple structure, which is composed of the separation orifice of the nozzle, vortex room and the cold and hot tube at both ends. The compressed gas expands in the nozzle and then enters the vortex tube along the tangential direction at a high speed. When the airflow rotates at high speed in the vortex tube, it is separated into two parts of the airflow with different temperatures after the vortex transformation. The air in the center is cooler, while the air in the outer part is hotter. According to the needs of application examples, the ratio of cold and hot flow can be adjusted to obtain the best cooling effect or heating effect.
Even the benchtop thermal forcing system appearance is similar as MECHANICAL DEVICES thermal forcing system, However, they are completely different in the application scenarios of product testing and the refrigeration principle of the machine. If you read the FLEXTC user manual carefully, pages 43 and 44, You will find that the MECHANICAL DEVICES thermal forcing system uses dry air or nitrogen to achieve rapid temperature heating and cooling in the test area. But you must understand that the cost of using nitrogen is too high, and chagrined at the high cost of purchasing nitrogen each year.
Benchtop thermal forcing system uses a vortex tube heating and cooling method. The gas entering the pipe is reconverted and quickly separated from the hot and cold air. The cold or hot air produced way is constant and cheap. Because the gas is a physical conversion, it is clean and does not cause any pollution to the environment of the test area.
In addition, during chip product testing, The MECHANICAL DEVICES temperature forcing system needs to be screwed or welded together with the chips. We can discover this fact by reading pages 45 and 46 of the FLEXTC user manual. As a result, the efficiency of chips testing is greatly reduced. The benchtop temperature forcing system uses natural and clean air for heat and cooling tests, So you just need to put the test samples in the right place to quickly complete the product inspection task. It is so convenient to use it.
Equipment Name |
Benchtop Thermal Forcing System |
Benchtop Thermal Forcing System |
Device Model |
QT-ATS005B-20 |
QT-ATS005B-40 |
Temperature Range |
-20°C~150°C |
-40°C~150°C |
Control Precision |
±1.0°C |
|
Temp Setting Accuracy |
0.1°C |
|
Temperature Overshoot |
≤1°C |
|
Carton Size |
400 * 450 *350 mm( W * D * H) |
|
Operation Method |
Program Method, Fixed Value Method |
|
Temperature Change Speed (Outlet, no load) |
-10°C~+85°C, about 15s |
-10°C~+85°C about 10s |
+85°C~-10°C, about 30s |
||
Statistical Airflow Output |
5~20 SCFM adjustable |
5~30 SCFM adjustable |
Temperature Sensor |
T-type Thermocouple |
|
Power Supply |
AC220V 50HZ single phase |
AC380V 50Hz three-phase |
Operating Power |
Around 1.0 KW |
Around 2.5 KW |
Noise Level |
≤65 dB Standard |
|
Temperature Control |
The gas temperature and sample temperature can be switched and controlled. |
|
Communication Method |
Network interface, USB, RS484 (provide third-party communication protocol) |
|
Supply Gas |
Temperature 23~25, Dew point gas below -20°C or Liquid Nitrogen N2 |
|
Supply Gas Conditions |
Pressure: 0.55-0.78MPa (6kg/cm2) |
|
Door Airtight Material |
When testing, provide sample temperature sensor for temperature measurement (a total of one). |
|
Airflow Transparent |
Inner diameter: 150mm Outer diameter: 185mm (one in total) |
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